DualCool™ NexFet™ Power MOSFETs

Texas Instruments introduced the industry’s first family of standard-footprint power MOSFETs that dissipate heat through the top of the package for high-current DC/DC applications. DualCool™ NexFET™ power MOSFETs reduce end equipment size, while providing up to 50 percent more current through the MOSFET and improving thermal management over other standard-footprint packages.

This new family of five NexFET devices allows computing and telecom system designers to use higher current processors with expanded memory while saving board space. These MOSFETs in an advanced package can be used in a wide range of end applications including desktop personal computers, servers, telecommunications or networking equipment, basestations, and high current industrial systems.